XG-50 Solder paste For Micro Soldering Low Melt Low Temperature Durable

Description

Product Description
XG-50 Solder paste For Micro Soldering Low Melt Low Temperature Durable
Product description:
Melting point is 183℃. Sn63/Pb37, you will not need it often, so you need to prepare a small bottle. These things enable you to remove components and connectors without using the ultra-high heat required to melt high-temperature solder. Put these things on the logic board a little bit, then use a soldering iron to mix the solder with low melting point solder paste, and then use micro tweezers or a hot air rework station to remove the connector/component at about 225°C.
Model: XG-50 Sn63/Pb37
Scope of application: mobile phone chip repair, computer or home appliance chip patch repair, BGA special products, chip-level repair tools
Applicable models: tin planting for mobile phone repair, BGA planting tin for computers in the electronics industry.
Features: The solder joints are white and full, and there is no phenomenon such as false soldering or false soldering, and it has a strong reconciling force with the soldering iron tip. It is a product that must be used to repair mobile phones and precision equipment. It is also an electronic production line, ideal for welding Supplies.
Package list:
1*solder paste
Note:
1. The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.
2. Please allow slight manual measurement deviation for the data.
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Delivery details
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ombined shipping
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because the shipping fee is calculated by weight. Also, the each additional item means
exactly
the the same color and size.
It takes about
7
-15 working days to US; about 10-30 working days to other countries.
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bad
weather and customs
inspection
. If you
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item
within 30 working days since payment finished, please contact us immediately for further assistance.
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