Mechanic Low Melt Tempature 183C Solder Paste SMT SMD BGA iPhone iPad Samsung

Description

MECHANIC Soldering Tin Cream XG-50 Sn63/Pb37 for SMT BGA Unleaded Welding Iron Station Flux Paste Soldering Repairing Tool
Product Features:
·
100% brand new and high quality.
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Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on g
ood soldering and welding tool.
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Unleaded MECHANIC BGA Solder Flux Paste Soldering Tin Cream Professional for BGA Soldering Iron Station.
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Free lead solder paste, 183
℃
, the degree of melting point, easy welding, easy molding.
Product Specifications:
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Material: Plastic+solder paste.
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Color: As picture shown
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Type:
XG-50 ,
35g
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Alloy: Sn63/Pb37.
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Microns: 25-45um.
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Application:
for BGA motherboard soldering iron station flux cream.
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Function: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
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Hi-Preformance.
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Storage Condition:0-10°c.
Note:
·
Harmful by inhalation and if swallowed.
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Danger of cumulative effects.
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Keep away from food,drink and animal feeding stuffs.
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When using do not eat,Drink or smoke.
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Avoid prolonged or repeated contact of any skin with solder paste. In case of solder paste ingestion see a doctor immediately.
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Store container welll closed and cool.