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Kester #44 Rosin Solder & Kester 186 RMA Flux, Desoldering Braid & Heat shrink

$ 13.2

Availability: 100 in stock
  • Bundle Description: Kester #44 Rosin Solder & Kester 186 RMA Flux, De-soldering Braid & Heat shrink
  • All returns accepted: ReturnsNotAccepted
  • Brand: Kester
  • Wire Diameter: 0.040 in
  • Container Size: .35oz Solder 2oz Flux
  • Condition: New
  • Solder Type: 60/40 Tin Lead Rosin Core Solder
  • Custom Bundle: Yes
  • MPN: 6300000186
  • Solder Form: Wire

    Description

    Please read the whole listing to understand the gravity of this package.
    This listing is for a complete professional soldering kit featuring a single .35oz tube of Kester #44 1mm (.040") diameter rosin core solder, 2oz of Kester 186
    RMA
    flux.
    Desoldering copper  braid that's 2mm wide x 4.9ft long pre-saturated in no-clean Flux
    . This kit is then finished by including 16in long pieces of heat shrink tubing
    with a (2:1 shrink ratio) in the following sizes 3mm, 6mm, and 1/2in. The heatshrink specs are listed below.
    These bottles all feature the product codes, date of manufacturing, and expiration dates as all Kester products should if there in compliance with US OEM standards.
    Beware of sellers offering repackaged products without these codes in inferior packaging which truly means you have no idea of what products your purchasing.
    Please read the specs below of this solder, and flux combo.
    This professional soldering package produces joints that are smooth as glass with superior gloss with virtually no end user effort.
    This is kit will ship free in the US. International shipping isn't available on this kit do to carrier regulations.
    If require a custom amount of heat shrink, solder, or flux please message me for custom configurations for your applications.
    Shrink Ratio: 2:1
    Minimum Shrinkage: Temp +70 Celsius
    Full Shrinkage Temperature: +125 Celsius (Maximum Shrinkage Achieved)
    Operating Temperature: -55 Celsius to +125 Celsius
    Tensile Strength: 10.4 MPA
    Dielectric Strength:
    600v
    Flame Retardant, Fluid Resistant, UV Resistant
    ISO9001 Certified
    Please review the overview video below of me discussing this kit.
    Please note this video was shot before my new REV2 Pro-grade resealable solder bottles were used pictured in this listing. These new bottles offer the freshest product available.
    Ultimate Soldering Kit (Kester 44 & Kester 186 RMA Flux With heatshrink - YouTube
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    Please read the details below on Kester #44 solder, and Kester 186 Flux
    Kester (44) Activated Rosin Cored Wire Solder
    Soldering Process:
    Solder iron tip temperatures are most commonly between 315-371°C (600-700°F) for Sn63Pb37 and Sn62Pb36Ag02 alloys.  Heat both the land area and component lead to be soldered with the iron prior to adding Kester 44 cored wire.  Apply the solder wire to the land area or component lead.  Do not apply the wire directly to the soldering iron tip.  If needed, Kester 186 Mildly Activated Rosin Flux may be used as a compatible liquid flux to aid in reworking soldered joints.  Kester 186 Mildly Activated Rosin Flux is also available in Flux-Pens® for optimum board cleanliness.
    Storage, Handling, and Shelf Life
    :
    Storage must be in a dry, non-corrosive environment.  The surface may lose its shine and appear a dull shade of grey.  This is a surface phenomena and is not detrimental to product functionality.  Flux cored solder wire has a limited shelf life determined by the alloy used in the wire.  For alloys containing > 70% lead, the shelf life is two years from date of manufacture.  Other alloys have a shelf life of three years from date of manufacture.
    Kester 186 Flux (
    RMA
    )
    Kester 186, under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, the flux residue after soldering is non-corrosive and non-conductive. 186 rosin flux has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux.
    This flux possess high thermal stability for soldering multi-layer assemblies which require a high preheat temperature. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistan
    t