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250K Qwin 0.25-0.76mm BGA Leaded Solder Balls BGA balls
250K Qwin 0.25-0.76mm BGA Leaded Solder Balls BGA balls
250K Qwin 0.25-0.76mm BGA Leaded Solder Balls BGA balls
250K Qwin 0.25-0.76mm BGA Leaded Solder Balls BGA balls

250K Qwin 0.25-0.76mm BGA Leaded Solder Balls BGA balls

$ 68.11

Availability: 20 in stock
  • Return shipping will be paid by: Buyer
  • Brand: QWIN
  • Item must be returned within: 30 Days
  • Restocking Fee: No
  • All returns accepted: Returns Accepted
  • Refund will be given as: Money back or replacement (buyer's choice)
  • Condition: New
  • Unit Quantity: 250K
  • MPN: 0.25MM--0.76MM 套装

    Description

    250K Qwin 0.25-0.76mm BGA Leaded Solder Balls
    Part Number
    0.25-0.76mm BGA Leaded Solder Balls
    Manufacturer
    Qwin
    BGA Alloy
    Sn63/Pb37
    Date Code
    17+
    Package/Case
    10 PCS
    Description
    Original new
    Technical Support
    BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
    BGA Chips is MOISTURE SENSITIVE DEVICES.
    Devices require baking, before mounting
    , Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet.
    Set the temperature and time as:
    125℃±5℃ x 24 hours
    or
    80℃±5℃ x 48 hours
    Pay attention to the difference between
    leaded (Pb) balls
    and lead free (No Pb) balls.
    Lead-free/No Pb BGA chips:
    245℃-260℃(Maximun)
    Leaded/Pb BGA chips:
    180℃-205℃(Maximun)
    Sufficient Stock